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| 产品详细 |
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| CT1PAL-H10-01 |
Application: 1U passive solution
CPU socket: LGA 3647 structure（NARROW)
CPU: Intel Purley – EP / EX, Socket LGA 3647
Structure: Using aluminum extrusion die technique.
Installation: screw
Size(mm): 108*78*25.5
Weight(g): 280g
(Reminder: If the weight of the cooler is ≥500g, to avoid CPU damage, we recommend not to install it on CPU while shipping.)
Thermal Interface Material: AD66（coefficient of thermal conductivity>4.0）
Backplate: N/A |
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| CT1PAL-H10-01 |
| Specification |
| Application |
1U passive solution |
| CPU socket |
LGA 3647 structure（NARROW） |
| CPU |
Intel Purley – EP / EX, Socket LGA 3647 |
| Structure |
Using aluminum extrusion die technique. |
| Installation |
screw |
| Size（mm） |
108*78*25.5 |
| Weight（g） |
280g
(Reminder: If the weight of the cooler is ≥500g, to avoid CPU damage, we recommend not to install it on CPU while shipping.) |
| Thermal Interface Material |
AD66（coefficient of thermal conductivity>4.0） |
| Backplate |
N/A |
| Fan Specification |
| Fan P/N |
N/A |
| Dimmension（mm） |
N/A |
| Rated volotage（V） |
N/A |
| Bearing type |
N/A |
| Rotation(RPM) |
N/A |
| Air Flow(CFM) |
N/A |
| Noise(dBA) |
N/A |
| Life expectation(H) |
N/A |
| Connector |
N/A |
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