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产品详细 |
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CT2AAL9-L5-01 |
Application: 2U server solution CPU socket: LGA 1155/1156/1150 (installation hole space:75*75 mm) CPU: Intel® Core™ i7-2600, i5-2500 series Intel® Core™ i3& i5,Xeon® Processor 3400 Series Structure: sunflower extrusion heatsink with 51*51*4mm aluninum stage Installation: screw+spring Size(mm): 92*92*63 Weight(g): 410 Thermal Interface Material: AD66(coefficient of thermal conductivity>4.0) Backplate:Optional |
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CT2AAL9-L5-01 |
Specification |
Application |
2U server solution |
CPU socket |
LGA 1155/1156/1150 (installation hole space:75*75 mm) |
CPU |
Intel® Core™ i7-2600, i5-2500 series Intel® Core™ i3& i5,Xeon® Processor 3400 Series |
Structure |
sunflower extrusion heatsink with 51*51*4mm aluninum stage |
Installation |
screw+spring |
Size(mm) |
92*92*63 |
Weight(g) |
410 |
Thermal Interface Material |
AD66(coefficient of thermal conductivity>4.0) |
Backplate |
optional |
Fan Specification |
Fan P/N |
F129025BU |
Dimmension(mm) |
95*95*25 |
Rated volotage(V) |
12 |
Bearing type |
Dual ball bearing |
Rotation(RPM) |
3500 |
Air Flow(CFM) |
59.82 |
Noise(dBA) |
44 |
Life expectation(H) |
50000 |
Connector |
4pins with PWM control |
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